I study the semiconductor advanced packaging ecosystem from a supply-chain and market perspective. My research covers packaging foundries, OSAT providers, substrates, interposers, packaging equipment, materials, testing, and the capacity requirements created by AI and high-performance computing. I write for this website because advanced packaging is no longer an isolated back-end manufacturing activity. It connects semiconductor design, wafer fabrication, memory integration, substrates, materials, equipment, testing, and system assembly. My work examines packaging capacity, customer concentration, technology transitions, production yields, investment requirements, and the changing competitive landscape. I also follow how AI accelerators and HBM systems are influencing demand for advanced packaging services. Another focus of my research is the relationship between packaging bottlenecks and semiconductor production. Even when leading-edge wafers and memory components are available, limited packaging capacity can constrain final system output. Through my articles, I aim to provide readers with a broader understanding of the advanced packaging value chain and explain how technology, capacity, investment, and supply-chain relationships influence the industry.
Advanced packaging industry analyst covering foundries, OSATs, substrates, interposers, materials, equipment, testing, capacity, and AI packaging demand.
Jonathan Mercer is an advanced packaging industry analyst focused on the broader ecosystem surrounding next-generation semiconductor integration. His coverage includes packaging foundries, OSAT providers, substrates, interposers, materials, equipment, and testing.
Jonathan examines how AI accelerators, HBM, chiplets, and high-performance computing are changing packaging requirements. He follows capacity expansion, customer demand, production yields, technology transitions, and investment plans across the packaging supply chain.
Packaging bottlenecks are a major theme in his research. Semiconductor production can be constrained even when wafers and memory components are available if advanced packaging capacity is insufficient to complete the final systems.
Jonathan also studies the competitive relationships among packaging companies and their upstream suppliers. Through his articles, he provides readers with a supply-chain perspective on advanced packaging and explains how technology adoption translates into new capacity and investment requirements.